Akira Maekawa

Abstract This paper proposes an improved contactless measurement method for vibration stress of piping systems, by which the measurement time is shorter and the measuring works are more simple. The proposed method includes two processes, in which the bending mode shape of piping vibration is identified by a transmission-type light emitting diode (LED) displacement sensor and the vibration stress is calculated based on beam theory using the approximated curve of the bending mode shape. The proposed method uses one advanced LED displacement sensor to measure the vibration stress in contrast to multiple conventional LED sensors, which must be used in the previous method developed by the authors. Therefore, the measuring system could be reduced in size and a light-weight and portable measurement instrument was developed. The measurement accuracy and reliability of the new method were validated by the vibration experiment using a mockup piping system.